The SMDA APP670 utilizes 6 placement heads with automatic nozzle swapping and 52 tape feeder positions to optimize your pick and place process. The APP670 uses a Flying Vision Alignment camera paired with an identification camera for high accuracy. Testing and prototyping is supported with the included bulk component tray, strip feeder tray and optional JEDEC tray.
Specifications;
Number of placement heads; 6
Average Placement Rate; 12.000 - 16.000 cph
Placement Accuracy; 0.025 mm
Positioning Accuracy; 0.01 mm
Min. Component size; 0201
Max. Component size; 40 x 40 mm
Max. Component height; 13 mm
Operating system; Windows 10
PCB Specifications;
Maximum PCb Size; 580 x 380 mm
580 x 310 mm (with nozzle swapping and bulk component tray)
Feeder positions; 70 (front 30, rear 40)
Bulk component tray; 1 included
Strip feeder tray; 1 included
Feeder Types; 8/12/16/24/32/44/56 mm
Electric feeder, Pneumatic feeder, Stick feeder
Automatic nozzle changer; 6 positions
Dimensions; 123 x 122 x 145 (h) cm
Weight; 414 kg
The APP670 is shipped per crate transport.
APP670 crate dimensions; 135 x 140 x 165 (h)
Shipping weight; 480 kg
